This ebook provides a step by step dialogue of the 3D integration strategy for the improvement of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive development blocks (cavity/microstip filters, duplexers, antennas), in addition to a multilayer ceramic (LTCC) V-band transceiver front-end midule exhibit the progressive results of this technique in RF/Wireless packaging and multifunctional miniaturization. Designs lined are according to novel rules and are offered for the 1st time for millimeterwave (60GHz) ultrabroadband instant modules.
Read or Download Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging (Synthesis Lectures on Computational Electromagnetics) PDF
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